| 摘要 |
PURPOSE:To maintain tip positions of inner leads with high accuracy and to manufacture a lead frame of high reliability by a method wherein tips of the inner leads are fixed by pasting an insulating tape coated with a thermoset adhesive. CONSTITUTION:Tips of inner leads 4 facing a die pad 2 are connected by using the adjacent leads 4 and a connection piece 11. A polyimide tape 10 coated with a thermoset adhesive whose thickness is 1/3 or higher of a thickness of the leads 4 is pasted on one face of the leads 4; it is heated and hardened to fix the leads 4. After that, the connection piece 11 is stamped and the tips of the leads 4 are separated. A semiconductor chip is placed on the die pad 2; the chip and the leads 4 are connected by a bonding operation and, after that, are resin-sealed. Thereby, tip positions of the inner leads can be maintained with high accuracy and a lead frame of high reliability can be manufactured. |
