发明名称 SURFACE MOUNT LED PACKAGE
摘要 PURPOSE: To precisely arrange an LED on a printed circuit board by a method, wherein the LED is provided with a first plane, a second plane opposed to the first plane, two electrical contacts arranged on the first plane, an a light-emitting section located on the second plane, and a first and a second path which are nearly like a rectangular parallelepiped and extend from the first plane of a case passing through the case are provided. CONSTITUTION: A surface-mounting LED package is equipped with a first plane 18, a second plane 20 opposite to the first plane 18, two electrical contacts 22 are arranged on the first plane 18, and a light-emitting section 24 is located on the second plane 20. A case 14 is mounted on the LED through press-fitting, ultrasonic welding, gluing or the like, and the case 14 is formed as a nearly rectangular parallelepiped. A first path 26 is made to extend from the first plane 28 of the case 14 passing through a part of the case 14, where the size, shape, and position of the first path 26 is determined so as to make the light-emitting part 24 of the second plane 20 confront the first path 26 and to receive the second plane 20 of an LED 12. A second path 30 communicates with the first path 26, extending from the second plane 32 of the case 14 to the third plane 34 of the case 14. By this setup, an LED can be precisely arranged on a surface-mounting board.
申请公布号 JPH03127874(A) 申请公布日期 1991.05.30
申请号 JP19900125253 申请日期 1990.05.15
申请人 DAIARAITO CORP 发明人 DANIERU DORAGUUN
分类号 G09F9/33;B60Q1/26;F21V19/00;H01L33/48;H05K3/30 主分类号 G09F9/33
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