| 摘要 |
A resin application system is provided to make the structure small in a longitudinal direction orthogonal to the carrying direction of a substrate even if two handling lanes are installed, by disposing at least a portion of a first moving instrument at the lower side of a first carrying path and at least a portion of a second moving instrument at the lower side of a second carrying path. A resin application system is composed of a resin applying apparatus for applying resin on a substrate carried in a predetermined direction and a resin hardening apparatus for hardening the resin applied on the substrate. The resin applying apparatus comprises a substrate carrying path(48A); a resin applying instrument(52A) for spreading the resin on the substrate; and a moving instrument(67A) for moving the resin applying instrument. At least a portion of the moving instrument is disposed at the lower side of the carrying path.
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