发明名称 APPARATUS FOR ETCHING
摘要 An etching device is provided to manufacture the substrate having high density circuit with the high yield by accelerating the etching liquid flow on the substrate by using the inhaler and the ejector. A substrate is supported by a substrate support(210). A blow nozzle(230) sprays the etching liquid on the substrate. An inhaler(250) is arranged at the outer circumference of the substrate support in order to collect the etching liquid. An ejector(270) is arranged to be faced with the inhaler and sprays the supplement fluid to the substrate. A sub-nozzle(290) is arranged to be adjacent to the blow nozzle and sprays the supplement fluid onto the substrate.
申请公布号 KR100889953(B1) 申请公布日期 2009.03.20
申请号 KR20070127333 申请日期 2007.12.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, YOUNG GEUN;KIM, SUNG JAE
分类号 H01L21/3063 主分类号 H01L21/3063
代理机构 代理人
主权项
地址