| 摘要 |
PROBLEM TO BE SOLVED: To polish it while suppressing a damage of a substrate, or effectively wash and eliminate an extraneous matter having large adhesiveness.SOLUTION: A buff processing device for buff-processing a substrate W comprises: a buff table that is a buff table 400 for supporting the substrate and is rotatably constructed; a buff head that is a buff head 500 to which a buff pad 502 for buff-processing the substrate can be attached, is disposed to an upper side of the buff table, and is rotatably constructed; a processing liquid supply part for supplying a processing liquid for buff-processing to the substrate; and a wall part that is a wall part 402 extending toward a vertical direction upper side for a whole peripheral direction in an outer side than a region for holding the substrate by the buff table, and is constructed so that the processing liquid can be stored to an inside region of the wall part.SELECTED DRAWING: Figure 6A |
