发明名称 THIN PLATE MATERIAL AND METHOD FOR FORMING REMOVAL SCHEDULED PART THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a thin plate material capable of causing a thin plate base material to hold a removal scheduled part with moderate holding power without forming an opening around the removal scheduled part and a method for forming the removal scheduled part.SOLUTION: A thin plate material 1 consisting of a metal thin plate base material 2 and having a removal scheduled part 3 includes: a coupling part 4 for coupling the thin plate base material 2 around the removal scheduled part 3 with a part of a periphery of the removal scheduled part 3; and a half blanking part 5 constituted by performing half blanking processing to a part along a periphery 3a except a coupled part of the removal scheduled part 3 with the coupling part 4. A method for forming the removal scheduled part forms the coupling part 4 for coupling the thin plate base material 2 around the removal scheduled part 3 with a part of the periphery of the removal scheduled part 3 at a part of the part along the periphery and forms the half blanking part 5 constituted by performing the half blanking processing at the part along the periphery 3a except the coupled part of the removal scheduled part 3 with the coupling part 4 by performing the half blanking processing to the part except a part at the part along the periphery of the removal scheduled part 3.SELECTED DRAWING: Figure 1
申请公布号 JP2016120513(A) 申请公布日期 2016.07.07
申请号 JP20140262531 申请日期 2014.12.25
申请人 SANDEN HOLDINGS CORP 发明人 ONO YUSUKE;SANO YOSHIHIDE;FUJISHIRO KOJI;MOGI KAZUKI;MORITA MITSUHIRO;WASHINO TOSHIYUKI
分类号 B21D28/10 主分类号 B21D28/10
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