| 摘要 |
ELECTRONIC PACKAGE SOCKET A socket comprises a housing member having a recess for receiving an electronic package therein, the housing member supporting a plurality of contact members for making contact with respective leads of the electronic package. A cover is pivotally mounted on the housing member for covering the electronic package received in the recess and for holding the electronic package therein under pressure. An adapter is provided for receipt in the housing member, the adapter having means for receiving and aligning the leads of the electronic package in a preferred pattern. The adapter has an opening therein arranged to communicate with the electronic package in assembly. The cover is made of aluminum or other good thermally conductive material and includes a recessed portion projecting inwardly through the adapter opening for making contact with the electronic package. As such, in assembly, heat generated by the electronic package is effectively released through the cover.
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