WIRING BOARD WITH INTERPOSER AND DUAL WIRING STRUCTURES INTEGRATED TOGETHER AND METHOD OF MAKING THE SAME

摘要

A wiring board with integrated interposer and dual wiring structures is characterized in that an interposer and a first wiring structure are positioned within a through opening of a stiffener whereas a second wiring structure is disposed beyond the through opening of the stiffener. The mechanical robustness of the stiffener can prevent the wiring board from warping. The interposer provides primary fan-out routing for a semiconductor device to be assembled thereon. The first wiring structure can further enlarge the pad size and pitch of the interposer, whereas the second wiring structure not only provides further fan-out wiring structure, but also mechanically binds the first wiring structure with the stiffener.

主权项

1. A wiring board with integrated interposer and dual wiring structures, comprising:
an interposer having contact pads at a first surface thereof, bond pads at an opposite second surface thereof, and metallized vias electrically coupled to the bond pads and the contact pads; a first wiring structure that covers the first surface and sidewalls of the interposer and is electrically coupled to the contact pads of the interposer and includes at least one conductive trace laterally extending beyond peripheral edges of the interposer; a second wiring structure that is electrically coupled to the first wiring structure and includes at least one conductive trace laterally extending over and beyond peripheral edges of the first wiring structure; and a stiffener having a through opening that extends through the stiffener, wherein the interposer and the first wiring structure are positioned within the through opening of the stiffener and the second wiring structure is disposed beyond the through opening of the stiffener and on an exterior surface of the stiffener.