METHOD FOR DIVIDING A COMPOSITE INTO SEMICONDUCTOR CHIPS, AND SEMICONDUCTOR CHIP

摘要

The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.

主权项

1. Method for dividing a composite into a plurality of semiconductor chips along a dividing pattern, comprising the following steps:
a) providing a composite which has a carrier, a semiconductor layer sequence and a functional layer; b) forming separating trenches in the carrier along the dividing pattern; and c) cutting through the functional layer by means of coherent radiation along the dividing pattern;
wherein the divided semiconductor chips each have a part of the semiconductor layer sequence, of the carrier and of the functional layer.