| 发明名称 |
METHOD OF FORMING ASPER-SILVER ON A LEAD FRAME |
| 摘要 |
A method for plating a lead frame comprises the steps of plating the lead frame with at least one plating layer including silver and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. The asper-silver layer is particularly beneficial for enhancing the adhesion of plastic molding compound to the lead frame. |
| 申请公布号 |
US2016204003(A1) |
申请公布日期 |
2016.07.14 |
| 申请号 |
US201514592548 |
申请日期 |
2015.01.08 |
| 申请人 |
KWAN Yiu Fai;LAM Yu Lung;YAU Chun Ho;AU Wing Lam |
发明人 |
KWAN Yiu Fai;LAM Yu Lung;YAU Chun Ho;AU Wing Lam |
| 分类号 |
H01L21/48;C25D3/46;C25D5/02;C23C18/31;C25D5/18;C25D7/12;C23C28/02;H01L21/288;C25D5/10 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for plating a lead frame, comprising the steps of:
plating the lead frame with at least one plating layer including silver; and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. |
| 地址 |
Tsuen Wai HK |
