| 摘要 |
An aspect of the present invention relates to a magnetron sputtering apparatus to increase density of plasma in a direction in which a target object is ejected in the plasma containing a material removed from a cathode target. According to an embodiment of the present invention, a magnetron sputtering apparatus comprises: a vacuum chamber; a cathode target that rotates on the outer side of a backing plate in the vacuum chamber; a magnetic circuit that is spaced from the outer side of the cathode target and defines an opening through which plasma including a target material removed from the cathode target is ejected; and a yoke installed in an outer circumference of the cathode target, and supporting the magnetic circuit. |
