| 摘要 |
The present invention relates to a wafer cleaning device capable of minimizing friction due to buoyancy of wafers. The present invention provides the wafer cleaning device which comprises: a water tank in which cleaning water is contained; a plurality of cassettes arranged in the water tank in series wherein wafers are placed in the cassettes; a cassette moving unit configured to move the cassettes into the water tank in series; a plurality of partitions installed to partition an inner side of the water tank and having holes through which the cleaning water can flow; and a water supply pipe installed on one side of the water tank and configured to supply the cleaning water into the water tank. The water tank allows the cleaning water to overflow during a cleaning process. |
