Light emitting device package having a package body including a recess and lighting system including the same

摘要

Provided are a light emitting device (LED) package and a lighting system including the same. The LED package comprises a package body comprising a recess in an upper portion thereof, and an LED chip provided in the recess of the package body. The LED package has a structure in which the LED chip may be buried into a recess formed on a planar surface on the upper portion of the package body such that a bottom surface of the recess lies below the planar surface. Thus, a main path through which heat generated from the LED chip is transmitted may be expanded from a bottom surface of the LED chip up to a lateral surface thereof to widen a dissipation area, thereby improving thermal emission efficiency.

主权项

1. A light emitting device (LED) package comprising:
a package body having a planar surface and a recess, wherein a bottom surface of the recess is lower than the planar surface; an LED chip comprising a substrate and a light emitting structure; and an electrode provided on the package body, wherein the substrate of the LED chip comprises a bottom surface and an upper surface, wherein the light emitting structure comprises a first conductive type semiconductor layer on the upper surface of the substrate, an active layer on the first conductive type semiconductor layer and a second conductive type semiconductor layer on the active layer, wherein the active layer is positioned above the planar surface of the package body, wherein the bottom surface of the substrate is formed of the same material as the upper surface of the substrate, wherein a lateral width of the light emitting structure is substantially the same as a lateral width of the upper surface of the substrate, wherein a lateral width of the package body is greater than a lateral width of the substrate of the LED chip, wherein the electrode is directly disposed on a bottom surface of the package body, wherein the substrate of the LED chip comprises a conductive substrate, wherein an upper portion of the package body comprises a conductive package body, wherein a top surface of the conductive substrate of the LED chip is positioned above the planar surface of the package body, wherein a bottom surface of the light emitting structure is positioned above the planar surface of the package body, wherein the substrate of the LED chip further comprises an inclined side surface and a vertical side surface, wherein the inclined side surface of the substrate is formed of the same material as the upper surface, wherein the inclined side surface is disposed in the recess, and wherein the entire vertical side surface is disposed above the planar surface.