| 摘要 |
Disclosed is a semiconductor package for allowing second semiconductor chips, a package substrate, and an electric path to pass through a surface of a first semiconductor chip. The second semiconductor chips are disposed to overlap some areas of the first semiconductor chip, respectively. The package substrate is disposed to interpose a narrow width interposer and the second semiconductor between the narrow width interposer and the first semiconductor chip. The electric path electrically connects the second semiconductor chip to the interposer. |
