发明名称 MICROFUSED SILICON STRAIN GAUGE (MSG) PRESSURE SENSOR PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide methods and apparatus for a microfused silicon strain gauge pressure sensor.SOLUTION: A pressure sensor package includes: a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge; an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length; a housing disposed about the sense element and electronics package; and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.SELECTED DRAWING: Figure 1
申请公布号 JP2016161567(A) 申请公布日期 2016.09.05
申请号 JP20160020435 申请日期 2016.02.05
申请人 SENSATA TECHNOLOGIES INC 发明人 ERNIE JOHANNUS ANTONIUS SCHOOT UITERKAMP;HEDZER DEDDE WIERSMA;FRANK HENDRI JACOBS
分类号 G01L19/00;G01L9/04 主分类号 G01L19/00
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