| 摘要 |
The present invention relates to a resin application device. Provided is the resin application device, comprising: a support frame; a resin discharge part which is disposed on one side of the support frame, has a filling space which is filled with resin, and has a discharge hole formed in a bottom of the resin discharge part to communicate with the filling space; a vertically movable block which is disposed on one side of the support frame and above the resin discharge part to be movable in a vertical direction; a driving part which is coupled to the vertically movable block on one side thereof, and provides moving force to the vertically movable block in a vertical direction; a piston part which is inserted into the filling space at a lower end thereof, comes into contact with one side of the vertically movable block at an upper end thereof, and, when the vertically movable block is moved downward, is pressed onto the vertically movable block and moved along with the vertical movable block. According to the present invention, the piston part is moved downward by pressing the piston part through the vertically movable block without combination of the vertically movable block and the piston part, and thus provided is an effect of enabling operation of the piston part to be smoothly performed while coating a plurality of LED chips with resin. |
