| 摘要 |
<p>PURPOSE:To form a stable thick film resistor having small TCR value and no offset by curing thermosetting resin to be used at a higher temperature than glass transition temperature after the resin is cured. CONSTITUTION:When resistance paste containing thermosetting resin as a binder is printed on a circuit board, and then cured to form a thick film resistor, it is cured at higher temperature than glass transition temperature after the resin to be used is cured. For example, liquid epoxy resin composition (200 deg.C of glass transition temperature after curing) containing 78 pts.wt. of epoxy resin and 123 pts.wt. of curing agent, 50 pts.wt. of carbon black and 50 pts.wt. of solvent (85wt.% alpha-theopineol, 15wt.% butylcarbitolacetater are kneaded for 1 hour to obtain resistor paste. The paste is screen-printed on an alumina circuit board formed previously with an Ag-Pd conductor electrode, dried at 100 deg.C for 10min, and then thermally cured at 260 deg.C for 1 hour.</p> |
