首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Silver-lead alloy contacts containing dopants for semiconductors
摘要
申请公布号
US3307088(A)
申请公布日期
1967.02.28
申请号
US19630265591
申请日期
1963.03.13
申请人
KYOICHI FUJIKAWA;TOKUZO SUKEGAWA;JUN-ICHI NISHIZAWA
发明人
FUJIKAWA KYOICHI;SUKEGAWA TOKUZO;NISHIZAWA JUN-ICHI
分类号
H01L21/00;H01L21/24;H01L29/00
主分类号
H01L21/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
BUTTERFLY VALVE WITH METAL VALVE SEAT
EMERGENCY SHUT VALVE
CLAMP AND ITS MANUFACTURE
AUXILIARY FUEL SUPPLYING DEVICE FOR DIESEL ENGINE
INDICATOR FOR GAME
POLAROGRAPHY SENSOR
DEVICE FOR MAINTAINING DISTANCE BETWEEN MUTUAL TRACK CAR
(A) ;ALPHA-SUBSTITUTED UREIDOBENZYLPENICILLIN
PRODUCTION OF CONDOM
TREATMENT OF WASTE GAS GENERATED BY OPERATING HIGH SPEED ROTARY PRESS
METHOD FOR CONTROLLING COATING THICKNESS
APPARATUS FOR KEEPING COOLING WATER FOR ENGINE WARM
VACUUM DEGASSING DEVICE OF MOLTEN STEEL
VACUUM REFINING METHOD OF LOW CARBON, LOW NITROGEN AND HIGH CHROMIUM STEEL
FIXING METHOD FOR SWITCH OR THE LIKE
STIRRING MECHANISM
MANUFACTURE OF INDOLO(2'',3'';3,4)PYRIDO(2,1- B)QUINAZOLINE-5-ONE
PRODUCTION OF POLYTETRAFLUOROETHYLENE RESIN COATED PLATE FOR FORMING
PREPARATION OF RESIN LINING CONTAINER
PACKING
