发明名称 PACKAGE FOR SEMICONDUCTOR-ELEMENT
摘要 PURPOSE:To reduce an attenuation of a signal to a minimum at an external lead terminal and to operate a semiconductor element normally and stably for a long term by a method wherein an insulating container, the external lead terminal and a glass member for sealing use are formed of prescribed materials. CONSTITUTION:An insulating substrate 1 and a lid body 2 which constitute an insulating container 3 are formed of spinel or a steatite sintered substance. Glass members 6, for sealing use, applied to opposite main faces of the substrate 1 and the lid body 2 are composed of a glass in which 15.0 to 30.0vol.% or lower of at least one kind out of lead titanate, beta-eucryptite, cordierite, zircon, tin oxide, willemite and tin titanate as a filler is added to a glass component which is composed of 70.0 to 90.0wt.% of lead oxide, 10.0 to 15.0wt.% of boron oxide, 0.5 to 3.0wt.% of silica, 0.5 to 3.0wt.% of alumina and 3.0wt.% or lower of zinc oxide and bismuth oxide. External lead terminals 5 between the substrate 1 and the lid body 2 are composed of a conductive material whose magnetic permeability is 200 (CGS) or lower, whose electric conductivity is 50% (IACS) or higher and whose coefficient of thermal expansion is 70 to 85X10<-7>/ deg.C.
申请公布号 JPH03167860(A) 申请公布日期 1991.07.19
申请号 JP19890308608 申请日期 1989.11.27
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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