发明名称 PACKAGE FOR SEMICONDUCTOR-ELEMENT
摘要 <p>PURPOSE:To firmly bond a terminal to a glass member by a method wherein the outer surface of a core body, composed of copper, of an external lead terminal is covered with a covering layer composed of an alloy of Ni and Fe at respectively specific wt.% and the terminal is constituted of a metal body in which a cross-sectional area of the covering layer is prescribed times a cross-sectional area of the core body. CONSTITUTION:External lead terminals 5 composed of an electrically insulating material are arranged between an insulating substrate 1 and a lid body 2; the terminals 5 are connected electrically to individual electrodes of a semiconductor element 4 via wires 7; the terminals 5 are connected to an external electric circuit. At this time, the terminals 5 are attached and bonded simultaneously between the substrate 1 and the lid body 2 when glass members 6, for sealing use, which have been applied to opposite main faces of the insulating substrate 1 and the lid body 2 are melted and united and an insulating container 3 is sealed airtightly. The outer surface of a core body, composed of copper, of the terminals 5 is covered with a covering layer composed of an alloy which is composed of 51.5 to 53.5wt.% of Ni and 47.5 to 48.5wt.% of Fe. The terminals are constituted of a metal body in which a cross-sectional area of the covering layer is 7.2 to 8.8 times a cross-sectional area of the core body; its magnetic permittivity is 14.8% (IACS) and its coefficient of thermal expansion is about 100X10<-7>/ deg.C.</p>
申请公布号 JPH03167849(A) 申请公布日期 1991.07.19
申请号 JP19890308593 申请日期 1989.11.27
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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