| 摘要 |
<p>PURPOSE:To prevent generation of warpage or twist of an IC card or an IC module by approximately equalizing the quantities of a dam base material and a contact base material to be expanded and contracted in a final hot press process. CONSTITUTION:The number of the hot press processes of a surface sheet member 6 and a rear sheet member 7 is equalized (each twice), and the conditions of the hot press are also made approximately the same. Consequently, when the rear sheet member 7 is thermocompression-bonded with the rear of a core member 5, the quantity of expansion and contraction in the plane direction of the surface sheet member 6 organizing both the surface and the rear of the core member 5 and that of the rear sheet member 7 can be made the same. Accordingly, the generation of warpage, bending, etc., as the whole IC card 1 can be prevented.</p> |
