| 摘要 |
1,098,398. Severing by grinding. LICENTIA PATENT - VERWALTUNGS G.m.b.H. April 26, 1965, No. 17525/65. Heading B3D. [Also in Division H1] A metal-coated silicon plate 2 is divided into smaller rectangular discs by the use of a cutting tool consisting of a set of spaced diamond saw blades 5. The blades and the spacers 6 between them are secured to a common rotary shaft 3 and each blade is a disc of steel or bronze with a bevelled edge clad with diamond powder, the included angle 8 of the symmetrically bevelled tip being between 30 and 120 degrees. The metal of the metal-coated plate may be gold, with or without an underlying layer of nickel. The silicon may contain one or more PN junctions, the completed devices thus constituting diodes or transistors. The silicon is supported during cutting by cementing it to a support plate, e.g. of glass. |
