ELECTRONIC CIRCUIT DEVICE AND CONDUCTOR PASTE USED THEREFOR

摘要

PURPOSE:To obtain an electronic circuit device having an extra-fine thick film circuit pattern having a sufficiently large film thickness by a method wherein the thick film conductor wiring is composed of a baked film which is made of material whose component is metal powder containing inorganic binder and has a line width not larger than 80mum and a film thickness not smaller than 15mum. CONSTITUTION:A thick film conductor wiring is composed of a baked film which is made of material whose main component is metal powder containing inorganic binder and has line width not larger than 80mum and a film thickness not smaller than 5mum. The thick film circuit which is baked on a ceramic substrate is made of paste composition containing conductive solid particles such as copper powder whose particle size distribution is so controlled as to have the particle diameters within a preferable range to suppress the shrinkage of the film thickness caused by baking. With this constitution, the reduction of the thickness of the circuit film formed on the ceramic substrate can be suppressed and, especially, an extra-fine low impedance electronic circuit pattern having a line width not larger than 80mum can be obtained.