| 摘要 |
<p>PURPOSE:To realize easy package and to improve yield and reliability by making an inner surface of a through-hole open to a side edge part and by forming a connection terminal to a matrix substrate by a conductive layer formed in the inner surface of the through-hole. CONSTITUTION:A plurality of through-holes 31 to 38 are formed at the same position in each of printed substrates 21a to 21g which form a transformer to a shape cutting off a side edge part thereof. Similarly, through-hole 41 to 48 are formed at the same position as the through-holes 31 to 38 on each insulating board 22 to a shape cutting off a side edge part thereof. Through-hole plating 13 is applied to through-holes 31 to 38, and 41 to 48; and lands 14a, 14b are formed successively after the plating 13 in a peripheral part of both sides of each substrate. Substrates 21a to 21g and a substrate 22 are laminated to form a lamination board 25; specified through-holes 31 to 38 are connected; a core is inserted; and a transformer is assembled. Since a conductive layer forms a connecting terminal to a matrix substrate, easy package is realized.</p> |
