| 发明名称 |
Low-melt poly(amic acids) and polyimides and their uses |
| 摘要 |
Provided are low-melt polyimides and poly(amic acids) (PAAs) for use as adhesives, and methods of using the materials for attaching two substrates. The methods typically form an adhesive bond that is hermetically sealed to both substrates. Additionally, the method typically forms a cross-linked bonding material that is flexible. |
| 申请公布号 |
US9365756(B1) |
申请公布日期 |
2016.06.14 |
| 申请号 |
US201313915407 |
申请日期 |
2013.06.11 |
| 申请人 |
The United States of America as Represented by the Administrator of the National Aeronautics and Space Administration |
发明人 |
Jolley Scott T.;Gibson Tracy L.;Williams Martha K.;Parrish Clyde F.;Snyder Sarah J. |
| 分类号 |
B29C71/00;C09J179/08;C09J177/00 |
主分类号 |
B29C71/00 |
| 代理机构 |
|
代理人 |
Ford Michelle L.;McTavish Hugh |
| 主权项 |
1. A method of attaching two substrates comprising:
(a) contacting two substrates with a low-melt polymer; and (b) heating the low-melt polymer to a bonding temperature effective to melt or cross-link the low-melt polymer and form an adhesive bond between the two substrates; wherein the low-melt polymer comprises a poly(amic acid) or a polyimide. |
| 地址 |
Washington DC US |
