| 摘要 |
<p>PURPOSE:To prevent that an IC module easily peels off even when the material quality of the seal resin of the IC module is different from that of a card main body by flatly forming the peripheral wall of a printed wiring board and that of a seal resin and forming the engaging hole becoming the engaging part of the IC module by the inflow and curing of an adhesive to the side wall of a receiving part. CONSTITUTION:A semiconductor element 13 is subjected to transfer molding using a seal resin 15 to form an IC module 10 which is, in turn, bonded to the receiving part of a card main body 20 formed into a shape almost same to that of the IC module through an adhesive 30 but the IC module 10 is formed so that the peripheral wall of a printed wiring board 11 and that of the seal resin 15 become flat and the engaging hole 26 becoming the engaging part 31 of the IC module 10 by the inflow and curing of an adhesive 30 when the IC module 10 is bonded is provided to the sidewall 25 of the receiving part 23 of the card main body 20.</p> |
