| 摘要 |
This invention relates to encapsulating by, molding, embedding, casting, impregnating, potting and encasing various components, e.g., decorative, electric, electronic and microelectronic components using a composition which is preferably transparent comprising (1) a liquid polyene containing at least two reactive unsaturated carbon to carbon bonds per molecule and (2) a polythiol containing at least two thiol groups per molecule, the total combined functionality of (a) the reactive unsaturated carbon to carbon bonds per molecule in the polyene and (b) the thiol groups per molecule in the polythiol being greater than four, which composition, with the aforesaid components therein, can be cured under ambient conditions in the presence of a free radical generator to a solid, elastomeric or resinous product.
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