| 摘要 |
The disclosure of this application is directed to polyepoxide compositions, containing dicyandiamide and an iodonium, phosphonium or sulfonium salt, which are relatively stable at room temperature and can be cured at moderately elevated temperatures in a relatively short period of time to thermoset products characterized by excellent thermal stability, and when used in adhesive applications to bond together materials such as wood, plastic and metal, by excellent bonding strength.
|
