Thin chipboard panel covered with resin impregnated paper - preventing overcuring leading to destruction of chip structure

摘要

Decorative laminated panel comprises a chipboard panel 1-5mm. thick with a heat-curable resin content of 8-35 wt. %; and a decorative paper layer impregnated with heat-curable resin. In addn. to the decorative paper layer, which is pref. impregnated with melamine resin, there may also be one or more sheets of soda kraft paper impregnated with phenolic resin. The panel is produced by curing the resin-impregnated chipboard, but not completely, and pressing it with teh decorative layer(s) at a pressure of 70-120 kp/sq. cm. and at temps. of 120-150 degrees C. Embossed press plates and bonding sheets may also be used in the mfr. of the panel to provide the decorative layer with spatial texturing. If the laminated panel is provided with the decorative paper layer on one side only, it may be provided with a sheet of paper on the other side.