| 摘要 |
<p>PURPOSE:To obtain the resin composition for semicondutor sealing which has excellent heat resistance property and dampproof property by a method wherein a polyfunctional epoxy compound, novolac phenol resin, a fluorine containing compound, and a resin composition containing an inorganic filler are used for the titled resin composition. CONSTITUTION:As the resin composition for semiconductor sealing, a polyfunctional epoxy compound, novolac phenol resin, a fluorine containing compound and a resin composition containing organic filler are used. Also, as a fluorine containing compound, especially tetrafluoroethylene or a copolymer of tetrafluorodthylene and a olefinic compound is used. The heat reisting property, hot-cold cycle resisting properties and dampproof property of the titled resin composition can be improved in the semicondutor sealing by using the compositions above- mentioned.</p> |
