RESIN SEALING DEVICE FOR SEMICONDUCTOR ELEMENT

摘要

PURPOSE:To pressurize the overall parting surface of metallic molds evenly while reducing the shock in case of metallic mold fitting by a method wherein elastic members such as springs are provided between a lower metallic mold and a movable platten or between an upper metallic mold and an upper platten. CONSTITUTION:The turning force of an AC servomotor 7 is transmitted to a ball screw 11 through the intermediary of a power transmission system fitting to a nut 12 a ball screw 11 i.e. Then a nut housing 31 is lifted to convert the turning force of motor 7 into the thrust further transmitted to a movable platten 40 through the intermediary of a double-toggle mechanism 30. At this time, springs 13 are provided in the space between a metallic mold retainer 42 and a movable platten main body 41 i.e. between a lower metallic mold 6 and a movable platten 40 so that overall surface may be pressurized evenly by the upper metallic mold 5 copying after the parting surface of lower metallic mold 6 even if e.g. the fitting precision of metallic molds and the parallelism of metallic mold fitting surface are unacceptable.