| 摘要 |
PURPOSE:To achieve miniaturization and to enhance the reliability of connection at low cost, by a method wherein the individual electrode on the first substrate and IC on the second substrate as well as IC on the second substrate and signal electrode wiring are respectively connected by wire bonding, and IC and the signal electrode wiring are provided on the same second substrate. CONSTITUTION:It is extremely important that electrode wiring 5 to a heat generating part 2, that is, the lead part 5a and the pad 11 of IC 7 are connected by wire bonding using a wire 14 and the terminal of the signal electrode wiring 8 on the side of IC, that is, the lead part 12 thereof and the pad 11 of IC 7 are connected by wire bonding using a wire 15. Because of such a structure that IC 7 and the signal electrode wiring 8 are together provided on the same substrate 9, the substrate, that is, a head can be miniaturized and, when only the alignment between both substrates 6, 9 is performed, connection can be performed automatically by wire bonding with good workability and good reliability. Since the lead part 5a can be allowed to approach a platen roller 17, a substrate size is further reduced to make it possible to still more attain miniaturization and cost reduction. |
