| 摘要 |
PURPOSE:To make the device extremely strong against vibrating shocks, to prevent corrosion and to simplify assembling works, by providing a thermosetting resin mold, which covers a circuit board, terminal groups and a packaging case so as to bond and fix them. CONSTITUTION:Soldering parts 14 are contacted with an electrode terminal group 11 of a circuit board 1, which is horizontally mounted on supporting parts 15. The soldering parts 14 and the electrode terminal group 11 are electrically connected by soldering. The bottom surface of a terminal group 2 is contacted with the floor part of a packaging case 3 and electrically connected to the packaging case 3. The terminal group 2 is fixed to the floor part of the packaging case 3 mechanically rigidly with a means such as electrical welding or brazing. A resin mold 4 is a one-pack type or two-pack type thermosetting resin. The resin covers the circuit board 1, the terminal group 2 and the packaging case 3 so as to bond and fix them. In this way, the circuit board 1 is fast fixed, and airtightness with respect to outer air can be maintained. |
