| 摘要 |
PURPOSE:To easily change connections between bonding pads and outer terminals by making a first outer terminal L-shaped wherein a first connection region planely crosses an intermediate region with a connection region of a second outer terminal and extends outward. CONSTITUTION:An outer terminal 11 comprises a first outer terminal 11a having a first connection region which permits connection of a fine metal wire 13 and a second outer terminal 11b having a second connection region, while the first connection region extends between the second connection region and a die stage 12 in parallel with a semiconductor chip 10 and outward. The fine metal wire 13 crosses the first outer terminal 11a of a terminal No. Tb for example, but the fine metal wire 13 passes over far from the first outer terminal 11a resulting no short circuit. Thus even if there is a need for changing the connection, only a position of the fine metal wire 13 connection may be changed so that modification in connection can easily and rapidly be performed at a low cost. |
