Method for making an integrally molded semiconductor device heat sink

摘要

A method of making a molded heat sink for plastic packages constructed for housing semi-conductor devices. Heat is removed from the semiconductor device by direct heat transfer from the device through upstanding members integrally molded in the top of the plastic housing. The integrally molded heat dissipation members facilitate cooling of the semi-conductor die which is not available by normal dissipation by convection and radiation through a generally planar external surface of the package. The molded members permit effective heat dissipation without the thermal coefficient of expansion mismatch which may occur between conventional molded packages and heat sinks secured thereto.