| 摘要 |
<p>PURPOSE:To prevent cracking and swelling of resin, easily form an ultra-thin package, and improve the reliability regardless of a large number of pins. CONSTITUTION:A 42% Ni.Fe lead frame 1 consists of islands la and leads 1b. A mount agent layer 2 is formed on an island 2, and a semiconductor chip 3 is placed thereon. The semiconductor chip 3 is electrically connected with leads 1b through bonding wires 4. An oxide layer 7 is formed on the surface of a metal layer 5 by anodizing, and the rear face of the metal layer 5 is coated with epoxy resin 6 by heating. The metal layer 5, oxide layer 7 and epoxy resin 6 are then bonded to the semiconductor chip 3, lead frame 1 and bonding wires 4 by thermocompression. Thus the semiconductor chip 3 is sealed by the resin 6. The chip 3 is then subjected to heat treatment at a temperature of 160 deg.C for three hrs. This improves the reliability of the semiconductor device.</p> |
