| 摘要 |
<p>PURPOSE:To prevent the blade far dicing from loading with remainders at dicing, relating to dicing of the wafer of semiconductor substrates, etc. CONSTITUTION:When a wafer is diced to a chip with a blade 2, an abrasive grain part a3 employs porous blade 2, and the interior of the blade 2 is provided with a pure water/air draining mechanism 4. When the wafer is diced with the blade 2, the mechanism 4 squirts the pure water or air from the inside of blade 2 through the porous abrasive grain part 3.</p> |
