| 摘要 |
PURPOSE:To improve the simplification of a process of manufacturing a multilayer interconnection board and the yield of the manufacture of the board and to contrive the improvement of mass production of the board by a method wherein an insulating film formation process is simplified by a specified method. CONSTITUTION:A horizontal wiring conductor 102 and a vertical via conductor 103 are formed on a base board 101, a sealing material 107 for sealing the peripheral parts of the conductors is provided and a metal mold 104 with the flat surface is fixed via spacers 108. Then, after a gap 105 among the conductors surrounded with the board 101, the metal mold 104 and the sealing material 107 is deaerated, a solventless fluid high-molecular precursor 106 is filled in the gap by a transfer molding system. After that, inert gas is sent in the metal mold through an air inlet 109 and while a hydrostatic pressure is applied, the precursor 106 is heated and hardened. Thereby, an insulating layer, which has no void and no pinhole and has the flat and uniform upper surface, can be formed. Moreover, in the case where the upper surface of the conductor 103 is covered with the insulating layer, the insulating film is etched back by dry etching or wet etching and the height of the conductor 103 is uniformly polished in a state that the conductor 103 is slightly made to expose. |
