Method of producing a conductive pattern on a substrate using planarization and etching steps

摘要

A method for producing a patterned region on a substrate is disclosed. The method comprises forming an insulating region over a surface of the substrate, forming a first masking region over the insulating region, transferring a pattern that is complementary to the desired patterned region to the first masking region and removing undesired portions of the first masking region, forming a conductive region over said patterned region and over said insulating region in regions corresponding to said removed portions of said first masking region, forming a second masking region over said conductive region, planarizing said second masking region remaining portions of said first masking region and said conductive region to form a substantially planar surface of said substrate, and removing remaining portions of said first masking region thereby leaving only said planarized conductive region.