| 摘要 |
<p>PURPOSE:To shorten the preparing time for cutting a chip by forming a breaking stage, on which a semiconductor wafer whose dicing is finished is mounted, of a roll bar, and providing a spring plate which is held with buffer materials on the outer surface of the roll bar. CONSTITUTION:The upper and rear surface of a semiconductor wafer 12 whose dicing is finished are coated with, e.g. a vinyl chloride and the like. The semiconductor wafer 12 is mounted on a breaking stage 11. The entire breaking stage 12 is formed of a roll bar. The semiconductor wafer 12 is compressed with a pushing plate 13 and the wafer is divided into may chips. The entire pushing plate comprises an elastic member made of, e.g. phosphor bronze. The pushing plate 13 is provided at the upper part of the breaking stage 11 so that the plate can be freely lifted and lowered. A rectangular spring plate 14 is held with buffer materials 15 such as, e.g. rubber, and provided between the breaking stage 11 and the pushing plate 13.</p> |
