发明名称 METHOD FOR REMOVING BRIDGE IN TWO-COLOR MOLDING AND DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To cut and separate a bridge and facilitate an operation to eject and remove the bridge, cut and separated, from inside a core sided part and further prevent a light shielding resin part from peeling during injection forming. SOLUTION: A character or the like is formed on a protrusion part 8 using a light-transmitting resin during injection molding and a recessed part formed on the protrusion part 8 with the light transmitting resin is filled by injection forming and a bridge 14 to be formed in a process to mold two-color moldings with an island part 11 encircled by a light transmitting resin part 7, isolated from a light shielding resin part body 10a is removed. In the device for removing the bridge 14 of the described structure, first shilding pins 4, 5 which move forward/backward with a cavity side part 1 are provided on a core side part 2 and arclike recessed undercuts are formed on the opposite faces. In addition, a second sliding pin 6 which moves forward/backward with the cavity side part 1, clamped by the first sliding pins 4, 5, is provided. Thus the bridge 14 can be easily removed to the outside of the core side part 2.
申请公布号 JP2000043090(A) 申请公布日期 2000.02.15
申请号 JP19980220118 申请日期 1998.08.04
申请人 TSUNODA EIICHI 发明人 TSUNODA TAKEYA
分类号 B29C45/38;B29C45/14;B29C45/16;(IPC1-7):B29C45/14 主分类号 B29C45/38
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