| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat dissipation capacity of the chassis member of a heat generating electronic device. SOLUTION: This chassis member 12 for supporting a heat generating electronic device is provided with a hollow 30 integrated into the chassis member 12, and working fluid 36 injected in the hollow 30. In this case, heat generated by the electronic equipment is moved from the hot place of the chassis member 12 to the working fluid 36 by the hollow 30 and the working fluid 36, the working fluid 36 is moved, and the heat is moved from the working fluid 36 to the cold place of the chassis member 12 so that the heat can be dissipated. |
