| 摘要 |
An apparatus for inspecting an IC wafer is disclosed in which an IC chips array on the IC wafer is divided into plural groups and inspection is carried out for each group. This apparatus comprises an inspection circuit board 4 for sending and receiving a signal to and from the IC chips 7 array, a common wiring board 3 having a signal main line 8 common to the respective IC chips 7 array of each group and for connecting the tester main body 1 to the inspection circuit board 4, and a resistor array board 11 having a plurality of protective resistors R. The inspection circuit board 4, the common wiring board 3 and the resistor array board 11 are arranged between the inspection circuit board 4 and the common wiring board 3 through the resistor array board 11 such that surfaces of the boards 4, 3, 11 are in opposing relation to each other. One end of each protective resistor R is connected to the inspection circuit board 4 at one surface of the resistor array board 11 and the other end is connected to the common wiring board 3 at the other surface of the resistor array board 11.
|
