| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a brittle member where the brittle member such as a wafer can be grinded so as to be very thin and handling enhancement in a following step is also possible, and to provide a both-side adhesive sheet that is preferably used for the processing method. SOLUTION: The method for processing the brittle member according to the present invention, comprising the steps of laminating a first adhesive layer, a first film, a second film that is releasably adhered to the first film, and a second adhesive layer in this sequence, laminating the brittle member on the first adhesive layer of the both-side adhesive sheet where at least one of the first film and the second film is a shrinkable film, peeling the first film from the second film by shrinking the shrinkable film after having laminated a hard plate on the second adhesive layer, and peeling the first film from the brittle member, is characterized in that the brittle member is processed in any stage before the peeling between the first film and the second film.
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