| 摘要 |
PURPOSE:To manufacture the title thin film removing device capable of removing the local part of a thin film such as resist layer, etc., within a short time without deteriorating the washability of a substrate surface such as wafer, etc., by a method wherein a specimen is held on a turntable; the position of the local part of the thin film on the specimen is determined by a polar coordinate system; and then the position is irradiated with the energy beams conforming to the coordinate values. CONSTITUTION:The title thin film removing device receiving a specimen W wherein a thin film is evenly formed on the surface of a substrate whereon a specific pattern is formed and then removing a local part of the thin film on a previously specified position for the pattern shall be provided with a turntable 7 holding said specimen W to be turned on almost central part thereof, detectors 2, 3 to detect the specific parts of the pattern on the specimen W, a measuring means to determine the position of the local part to be removed on the thin film by the polar coordinate system making reference to the turning center 0 of the turntable 7 conforming to the detection results of the deterctors 2, 3 and the coordinate positions on the pattern design as well as a beam irradiating means 1 to irradiate the local part on said thin film with the energy bean for removing the thin film. |
