ADHESIVE COMPOSITION

摘要

Disclosed is an adhesive composition which can exhibit good adhesion strength to the surface of a wiring metal or a polyimide surface exposed between wires on a flexible wiring substrate even when the surface remains relatively smooth. The adhesive composition comprises a thermoplastic resin, a polyfunctional acrylate and a radical polymerization initiator, and further comprises a monofunctional urethane acrylate having an urethane residue at the terminal and represented by the formula (1). CH2=CR0-COO-R1-NHCOO-R2 wherein R0 represents a hydrogen atom or a methyl group; R1 represents a bivalent hydrocarbon group; and R2 represents a lower alkyl group which may be substituted.