| 摘要 |
A semiconductor device includes a substrate; an external electrode terminal for electrically connecting to an external electrode; a first semiconductor chip provided above the substrate, having a plurality of electrode pads disposed on a major surface thereof; a second semiconductor chip provided above the first semiconductor chip, having a plurality of electrode pads disposed on a major surface thereof; and connection lines for connecting the electrode pads to the external electrode. A part of the major surface of the first semiconductor chip faces a part of the surface opposite to the major surface of the second semiconductor chip; and the first semiconductor chip is shifted from the second semiconductor chip, so that the second semiconductor chip does not overlap the electrode pads of the first semiconductor chip.
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