| 摘要 |
<P>PROBLEM TO BE SOLVED: To remove an air layer inevitably generated between an incident surface of a light guide plate and an LED at assembly caused by technically unavoidable reasons such as an error raised when manufacturing a chip LED and a light guide plate, a problem at the front side and back side of the chip LED module, a problem raised when mounting the chip LED, and a problem of positional deviation of the chip LED raised at reflow, or the like. <P>SOLUTION: The backlight comprises the light guide plate on the incident surface where the light emitted from the chip LED is incident, and a light leakage prevention body to which a potting is applied in order to remove the air layer generated between the light guide plate and the LED light source. On the backlight, the light from the chip LED is effectively made incident on an incident surface of the light guide plate without reflection. Brightness is improved by mounting a liquid crystal panel on the light-emitting surface of the backlight. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
