| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for bonding an inner lead to an electrode pad correctly. <P>SOLUTION: A manufacturing method of μBGA:IC17 wherein chips 12 are fixed to a tape carrier 2 of which one principal surface is provided with a plurality of inner leads 7 via an insulating film 10, and each electrode pad 14 of the chips 12 is bonded to each inner lead 7, includes steps of: optically observing one unit area including a chip 12, when the inner lead 7 is bonded to the electrode pad 14; recognizing the center position of the inner lead 7 based on the observation result; aligning the tip of a bonding tool 25 to the center of the inner lead 7; and bonding the inner lead 7 to the electrode pad 14 by the bonding tool 25. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
