| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate a method of fabricating an electrical contact that runs through a through hole in a substrate. <P>SOLUTION: The through hole is filled at least in part with a liquid conductive material and the solidified liquid conductive material forms an electrical contact through the through hole. The method includes a process for laminating a first substrate and a second substrate, a process for applying a first pressure to the through hole, a process for providing the through hole with the liquid conductive material, a process for applying a second pressure to the liquid conductive material, and a process for separating the lamination of the substrate from the liquid conductive material. <P>COPYRIGHT: (C)2008,JPO&INPIT |
